![]() ![]() PoP solder paste is a bit more challenging to set-up and maintain because of the possibility of bridging, but it will help with components that warp. PoP flux is most commonly used, rather than PoP solder paste, because of the ease in setup and maintenance. The memory package is then dipped into a PoP solder paste or flux, placed on top of the logic chip, and then reflowed. Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and then placing the logic chip into the paste. Low voiding solder paste with a wide reflow windowĪ no-clean RMA solder paste with excellent soldering performance Superior wetting to a variety of surface finishes and exhibits the best voiding performanceĪ versatile, low-voiding solder paste (InPb)Ī low voiding solder paste with a wide reflow window Specialty solder paste (InPb) for soldering to gold surfaces Industry-leading solder paste with a soft residue that reduces false failures at ICTĮxceptional stencil life and tack strength, and consistent print definition in ultra-fine pitch applications Modified version of NC-SMQ92J that maximizes print performance No-CleanĮxcellent print transfer efficiency for the broadest range of processes With decades of proven flux technology, these solder pastes will provide you with the highest end-of-line yields. Indium Corporation offers a number of SnPb solder pastes for circuit board assembly and high-Pb applications common in semiconductor packaging. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. No-clean solder paste is by far the most prevalent solder paste in modern electronic manufacturing, but there is still a purpose and a fit for water-soluble and RMA solder paste as well. ![]() Solder Paste Features & Benefits Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. I will be giving a paper on hotbar soldering in the morning on Thursday October 12, as p. Read More Join Me at SMTAI 2023įolks, This year SMTAI is in Minneapolis from October 9 to October 12. Read More Stencil Printing Response to Pauseįolks, Good friends Phil Zarrow and Jim Hall did an episode on their world famous “podcast” “Boardtalk” on the importance of response t. Read More Using ANOVA to Compare Three or More Solder Pastes for a Metric-Like Transfer EfficiencyĪn Interview with Professor Patty Coleman. Methodical development, proper selection, and application of advanced packaging materials for the various assembly processes are crucial to ensuring high production yield for the assembly process for advanced packaging and SiP applications. Read More Development of Innovative Advanced Packaging Materials for System in Package However, sometimes specification limits are not symmetrical. SiP & Heterogeneous Integration & Assembly (HIA)Ĭlose Related Solder Paste Blog Articles How to Calculated Equivalent Cp and Cpk when Spec Limits are Not Symmetricalįolks, Cp and Cpk assume symmetrical specification limits with respect to the target.The Indium Corporation & Macartney Family Foundation. ![]()
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